Saturday, February 23, 2013

TERMINOLOGY- BAO BÌ


THUẬT NGỮ BAO BI KIM LOẠI-CAN TERMINOLOGY

Nguồn The Canadian Food Inspection Agency

 

+Three Piece Can Bodies - Soldered Side Seam

Body - May vary in shape, body beads may be present, and is constructed of electrolytic tinplate (ETP).

Body Bead - Ridges or rib-like indentations on the can body located singly or in clusters on the general body area to provide resistance to lateral abuse (denting).

Flange - The outward flared edge of the can body that becomes the body hook of the double seam.

Lap - The short length of the side seam adjacent to each end where the side seam is reduced to two overlapping layers of metal plate bonded by solder.

Notch - The small cut-away portion of the body blank in the lap area which will reduce the amount of material in the area where a double seam will be formed.

Side Seam - The joint connecting two edges of the body blank (a piece of metal plate cut to individual can size). Along most of its length this joint consists of four tightly interlocked and soldered layers of metal plate (side seam fold). For a short distance adjacent to each end (lap areas) the side seam is only two layers thick.

Side Seam Enamel Margin (inside) - These are narrow strips of uncoated metal plate along the inside edges of an inside coated body blank that will form the side seam. The margins must be present, as organic coatings in either margin will preclude complete soldering of the side seam.

Side Seam Enamel Margin (outside) - These are narrow strips of uncoated metal plate (approximately 1 cm wide) along the outside edges of an outside coated body blank that will form the side seam. The margins must be present, as organic coatings in either margin will preclude complete soldering of the side seam.

Side Seam Indent - A small dent usually located at each end of the side seam fold. It strengthens the side seam, minimizes side seam bow and controls the cylinder length at the side seam.

Side Seam Vent - An opening in the side seam fold which allows the gases formed during soldering to escape and permits solder to flow into the folds.



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